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Prechofaj Touch Screen BGA Rework machin

Li se yon ideyal pou ranplase ti eleman sou smartphones san yo pa domaje konektè ki tou pre ak lòt pati plastik.

Dekri teren

Prechofaj Touch Screen BGA Rework machin

 

1. Karakteristik pwodwi nan Prechofaj Touch Screen BGA Rework machin


preheating touch screen bga rework machine.jpg

Zòn tanperati anwo ak anba yo chofe poukont yo, Yon fanatik kwa-koule refwadi rapidman pou pwoteje PCB la kont

deformation lè soude.

2. Pou gwo kapasite tèmik PCB oswa lòt kondisyon soude wo-tanperati ak plon-gratis, tout ka

okipe fasil.

3. Siveyans Pre-Heater anpeche yon operatè kòmanse yon pwofil lè aparèy chofaj la pa pare.

4. Yo ka etenn pre-chofaj oswa mete nan SetBack lè yo pa itilize sistèm.

Vacuum pik te bati nan ajisteman theta pou fasil pwezante nan eleman yo.

5. Apre BGA retire ak soude gen fonksyon alam vwa.


3.Specification nan Prechofaj Touch Screen BGA Rework Machine


pcb rework station.jpg


4.Detay nan Prechofaj Touch Screen BGA Rework Machine

1. HD Touch ekran koòdone;

2.Twa aparèy chofaj endepandan (lè cho ak enfrawouj);

3. Vacuum plim;

4.Led lanp.



5.Poukisa Chwazi Prechofaj Touch Screen BGA Rework Machine nou an?



6.Certificate nan Prechofaj Touch Screen BGA Rework Machine


bga reflow machine.jpg


7.Packing & chajman nan Prechofaj Touch Screen BGA Rework machin



8.Konesans ki gen rapò

Double-sided pwosesis melanje nan SMT

A: incoming inspection => PCB's B-side patch glue => patch => curing => flap => A-side PCB plug => wave soldering => 

cleaning => test =>retravay

Post-paste premye, apwopriye pou konpozan SMD plis pase konpozan disrè

B: incoming inspection => PCB A-side insert (pinning) => flap => PCB B-side spot adhesive => patch => curing => flap => 

wave soldering => cleaning => Test =>Rework Post-insertion ak post-fitting, apwopriye pou separe plis konpozan

pase konpozan SMD

C: incoming material inspection => PCB's A surface silk screen solder paste => patch =>

drying => reflow soldering => plug-in, pin bending => flap => PCB B surface patch glue => Patch => Curing => Flap =>

 Wave Soldering => Cleaning => Detection =>Retravay A sifas melanje, B sifas mòn. ?

D: incoming inspection => PCB's B side spot adhesive => patch => curing => flap =>PCB's Yon keratin soude soude silk

=> patch => A side reflow => plug-in => B-side wave soldering => cleaning => test =>retravay A-bò melanje, B-bò aliye.

Premye SMD, reflow, pòs-fabrikasyon, vag soude

E: incoming inspection => PCB side B silk screen solder paste (point mount glue) => patch => drying (curing) => reflow soldering => 

flap => PCB side A silk screen solder paste => Patch => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => 

Wave soldering 2 (If there are few components, you can use manual soldering) => Cleaning => Test =>Retravay yon mòn sifas,

B figi melanje.


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